X-Ray Inspection Machine Supplier for IC Semiconductor

X-Ray inspection system is high-precision detection equipment. It inspects and analyzes the inner structure of the object without damage via the penetration power from X-Ray.

It has been widely applied to BGA detection, LED, SMT, IC semiconductor, battery, automotive electronics, ceramic products, casting, plastic, connectors, 2.5D image analysis, pharmaceutical products and other industries.

A Leader in the Intelligent x-ray Detection Equipment 15 years experience in SMT field, Makes us understanding the customers’ demand and requirement very well!

–Inspection of internal cracks and Defects analysis of internal conditions (Analysis of internal displacements)

Youtube Demo: X-Ray Inspection Machine Supplier for IC Semiconductor

  • SMT/Semiconductor/Solar/Connector/LED
  • High-definition image: Slanting/Bridge/Voids/Cold Solder/Bonding wire
  • 100KV 3um (130 KV Optional)closed X-ray tube,long life time,maintenance in free
  • 2.3 mllion high resolution digital flat panel detector
  • 6 axis linkage system.
  • 60 degrees observation
  • Platform 360° rotation
  • Color lmage Navigation & Mapping Navigation
  • Mapping Mosaic Function.(optional )
  • Scalable 3D module(industrial CT) (optional)
  • Programmable Detection.(optional )


1) Defect inspection in IC encapsulation, e.g.: layer separation, cracking, void, and line integrity.

2) Measuring chip size, measuring line curvature, measuring the proportion of solder area of components.

3) Possible defects in PCB manufacturing processes, e.g.: misalignment, solder bridge and open.

4) SMT solder short, cold solder, component shifted, solder insufficient, solder void inspection and measurement.

5) Defect inspection of open, short or abnormal connections that may occur in automotive wiring harnesses and connectors.

6) Inner rupture or hollow inspection in plastic or metal.

7) Battery stacking uniformity, electrode welding inspection.

8) Seed, biological material inspection etc.

Application Field

LED, SMT, BGA, CSP, Flip Chip Inspection

Semiconductor, Packing components

Battery Industry

Electronic components, Auto parts, Photovoltaic Industry

Aluminum Die Casting, Moulding Plastic

Ceramics, Other special Industries

Related Article: x ray knowledge

Non-destructive testing DR X-Ray imaging

X-Ray Inspection Machine Supplier for IC Semiconductor Technical Parameters

X-RAY launching tube Maximum tube voltageSealed type X-ray Tube
X-RAY launching tube Maximum tube voltage90kV (130kV Optional )
X-RAY launching tube current10-300uA
Focal size5-8 μm
Detector Image Speed20 fps
Detector Resolution1536*1536
Detector Tilt angleStage 360°rotation,Detector Tilting,Easily to detect the BGA soldering
Stage size500mm*500mm
Net weight1900 kg
Input voltageAC 110-220V (+10%)
X-ray leakage amount≤1 u Sv/h
Operation SystemWindows 7/Windows 10
Total power1.5Kw
Flat Panel DetectorHD
LCD Monitor24 Inch
DimensionL:1700mm, W :1770mm, H:1800mm
 X-Ray Inspection Machine Supplier for IC Semiconductor

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