X7600 X-Ray equipment manufacturers-PCBA BGA IC Solder short/Crack
- High-definition image: Slanting/Bridge/Voids/Cold Solder/Bonding wire
- 90KV 3um (130 KV Optional)closed X-ray tube,long life time,maintenance in free
- 2.3 mllion high resolution digital flat panel detector
- 6 axis linkage system.
- 60 degrees observation
- Platform 360° rotation
- Color lmage Navigation & Mapping Navigation
- Full Automatic BGA Detecting Procedures
- Simple mouse click programming ,automatically detects the components of each BGA without the need for operator intervention
- Automatic IC Semiconductor detect, accurately check the bridge, welding, cold welding and void ratio of BGA.
- Automatic IC Semiconductor detect ,repeatable detect results in order to process control
- Detect results will be displayed on the screen and can be output to Excel to facilitate review and archiving
X7600 X-Ray equipment manufacturers- Application
1) Defect inspection in IC encapsulation, e.g.: layer separation, cracking, void, and line integrity.
2) Measuring chip size, measuring line curvature, measuring the proportion of solder area of components.
3) Possible defects in PCB manufacturing processes, e.g.: misalignment, solder bridge and open.
4) SMT solder short, cold solder, component shifted, solder insufficient, solder void inspection and measurement.
5) Defect inspection of open, short or abnormal connections that may occur in automotive wiring harnesses and connectors.
6) Inner rupture or hollow inspection in plastic or metal.
7) Battery stacking uniformity, electrode welding inspection.
8) Seed, biological material inspection etc.
LED, SMT, BGA, CSP, Flip Chip Inspection
Semiconductor, Packing components
Electronic components, Auto parts, Photovoltaic Industry
Aluminum Die Casting, Moulding Plastic
Ceramics, Other special Industries