X7600 X-Ray equipment manufacturers-PCBA BGA IC Solder short/Crack

  • SMT/Semicon/Solar/Conn/LED
  • High-definition image: Slanting/Bridge/Voids/Cold Solder/Bonding wire
  • 90KV 3um (130 KV Optional)closed X-ray tube,long life time,maintenance in free
  • 2.3 mllion high resolution digital flat panel detector
  • 6 axis linkage system.
  • 60 degrees observation
  • Platform 360° rotation
  • Color lmage Navigation & Mapping Navigation
  • Full Automatic BGA Detecting Procedures
  • Simple mouse click programming ,automatically detects the components of each BGA without the need for operator intervention
  • Automatic IC Semiconductor detect, accurately check the bridge, welding, cold welding and void ratio of BGA.
  • Automatic IC Semiconductor detect ,repeatable detect results in order to process control
  • Detect results will be displayed on the screen and can be output  to Excel to facilitate review and archiving

Youtube: 7600 X ray Equipment video-how to detect

X7600 X-Ray equipment manufacturers- Application

1) Defect inspection in IC encapsulation, e.g.: layer separation, cracking, void, and line integrity.

2) Measuring chip size, measuring line curvature, measuring the proportion of solder area of components.

3) Possible defects in PCB manufacturing processes, e.g.: misalignment, solder bridge and open.

4) SMT solder short, cold solder, component shifted, solder insufficient, solder void inspection and measurement.

5) Defect inspection of open, short or abnormal connections that may occur in automotive wiring harnesses and connectors.

6) Inner rupture or hollow inspection in plastic or metal.

7) Battery stacking uniformity, electrode welding inspection.

8) Seed, biological material inspection etc.


LED, SMT, BGA, CSP, Flip Chip Inspection

Semiconductor, Packing components

Battery Industry

Electronic components, Auto parts, Photovoltaic Industry

Aluminum Die Casting, Moulding Plastic

Ceramics, Other special Industries

Related Article: x ray knowledge

Non-destructive testing DR X-Ray imaging

X7600 X-Ray equipment manufacturers-PCBA BGA IC Solder short/Crack Technical Parameters

X-RAY launching tube Maximum tube voltageSealed type X-ray Tube
X-RAY launching tube Maximum tube voltage90kV (130kV Optional )
X-RAY launching tube current10-300uA
Focal size5-8 μm
Detector Image Speed20 fps
Detector Resolution1536*1536
Detector Tilt angleStage 360°rotation,Detector Tilting,Easily to detect the BGA soldering
Stage size500mm*500mm
Net weight1900 kg
Input voltageAC 110-220V (+10%)
X-ray leakage amount≤1 u Sv/h
Operation SystemWindows 7/Windows 10
Total power1.5Kw
Flat Panel DetectorHD
LCD Monitor24 Inch
DimensionL:1700mm, W :1770mm, H:1800mm

X7600 X-Ray equipment manufacturers-PCBA BGA IC Solder short/Crack

X7600 X-Ray equipment manufacturers-PCBA BGA IC Solder short/Crack

    We will reply you soon!