X-Ray Inspection System for PCBA/SMD and Electronic Components, SMT BGA, CSP, Flip-Chip, IC semiconductor components, connectors, wire, photovoltaic modules, batteries, ceramic products and so on.
Analytical tool for the SMT PCB manufacturing process, inspection of boards, components and solder joints. Inspection of internal cracks and Defects analysis of internal conditions (Analysis of internal displacements)