Seamark ZM Productronica & NEPCON China 2019

Seamark ZM Productronica China 2019

The productronica China ( shanghai ) 2019 closed after three successful days, thanks all clients who visited seamarkzm booth and give positive feedback, we will keep moving forward and make better products for all customer.

SeamarkZM have showcase its latest IR BGA rework system & X ray SMD chip component counter machine & x-ray inspection machine at the productronica China ( shanghai ) 2019.

Seamark ZM NEPCON China 2019

The NEPCON China 2019 exhibition which will be held at April 24 – 26, 2019, in Shanghai. Seamark ZM will showcase the new machine including semi-automated & fully-automated IR BGA rework system ZM R7850A, 2D & 2.5D off-line x-ray inspection machine X6600, inline x-ray inspection system, and x-ray parts counter X1000.

If you’d like to schedule a meeting with us at the NEPCON China 2019, please contact our Sales team– Email sales25@zhuomao.com.cn, Whatstapp/Wechat/Tel: +8618779975930. Look forward to seeing you at NEPCON China 2019, Hall 1, booth 1B40.

Family of Industrial X-ray inspection machine & BGA rework station

Last Article: Method for detecting electronic components quickly

Next Article: Formation and prevention of SMT BGA voids

Hot: The Reason for BGA insufficient solder & short

Maybe you still are interested inSolder paste printing defects and solutions in SMT chip processing process

Advantages of X-ray SMD counter

The difference between the detection equipment AOI & X-RAY