X Ray BGA machine use – detecting bga PCB
BGA- Ball array package, which is a highly integrated package, uses array solder balls on the bottom of the package substrate to interconnect the I/O terminals of the circuit with the printed circuit board PCB. The quality of the BGA soldering has a large impact on the packaged device.
X Ray BGA machine use:
Since the packaged product cannot be visually inspected, X Ray inspection BGA machine, ultrasonic can detect the quality. The most commonly used tool is X-RAY BGA machine, which not only has the function of visual inspection, but also saves the image for analysis， area measurements can be made on the contours of product defects.
BGA solder joint inspection application:
IC, PCBA, LED, lithium battery, IGBT, etc. Object detection: For chip size measurement, chip position, cavity, lead frame, wire, open circuit of connection line, short circuit, abnormal connection, ceramic capacitor structure, trace , solder joint holes, poor molding, bridging, tombstoning, insufficient solder / excess solder, component tin area ratio, device missing.
Seamark ZM, We want to support some distributor to attend this exhibition to open the market.
And plans to participate in the following exhibitions, welcome dealers, agents，distributor to discuss related matters.
ExpoElectronica/Electrontech 2019 Russia 2019 4.15-17 NEPCON Korea 2019 5.15-17
NEPCON Thailand 2019 6.19-22 NEPCON Vietnam 2019 9.11-13
EP India 2019 9.25-27 Electronica 2019 Germany 2019.11.12-15
Contact Person: Ms Joy Rong Tel/Wechat/Whatsapp: +8618779975930
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